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High-density 8-layer IC substrate

Some information about High-density 8-layer IC substrate

TypePCBA
Industry experience8+years
Place of OriginZhongshan,China
Company NameHUISHINE
Product FeaturesHigh integration,Maintainability,Light weight,High reliability,Small size…
Factory Area20,000 square meters
ConditionNew
ServiceOne Stop OEM Services Provided
ApplicationAerospace,Automation,Industrial Control,Medical Electronics,Smart Home…etc
RAMCustomized
Introduced equipmentselective wave soldering,flying probe testers,automatic soldering machines…
Surface FinishingHASL/ENIG
Warranty1 year
PaymentWestern Union,L/C,paypal,T/T…etc
LayerCustomer’s Requirements
Packing Size100 * 30 * 86 According to container size, standard export package
Tolerance of Impedence Control5%
Trading CountryAfrica,South america,Europe,North america,North Korea,Ethiopia,Oman,Libya…
KeywordsPCB PCBA
Terms of deliveryEXW,FOB,CFR…
Selling UnitsSingle item
Employees500+
After-sales ServiceOnline support

Please note: The above table data is for reference only. For specific information, please contact us.


Our some PCBA products

High-density 8-layer IC substrate
High-density 8-layer IC substrate

Our company and workshop for High-density 8-layer IC substrate

High-density 8-layer IC substrate

Exhibitions our company participated in

High-density 8-layer IC substrate

Our some certificate of High-density 8-layer IC substrate

High-density 8-layer IC substrate
Picture of Zhu, Linda

Zhu, Linda

Assemble 20 PCBs for $0

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