Verifying Every Assembly Before It Reaches Your Customer

Inspection tells us whether a PCB has been assembled correctly. Testing tells us whether it performs as intended.

Our testing processes combine automated inspection, electrical testing, programming and functional verification to ensure product quality.

Discuss Your Testing Requirements
Electronics test laboratory with PCB assemblies in fixtures

Inspection Before Testing

AOI — Automated Optical Inspection

Detecting visible assembly defects including:

  • Missing components
  • Wrong components
  • Component offset
  • Solder bridges
  • Soldering defects

X-Ray Inspection

For hidden solder joints and advanced packages such as BGA and QFN.

Inspection can identify:

  • Voids
  • Opens
  • Shorts
  • Solder joint defects
X-ray inspection of a PCB with BGA packages

Electrical Verification

ICT — In-Circuit Test

ICT checks electrical and component-level conditions including:

Component Values
Open Circuits
Short Circuits
Circuit Connections
Electrical Parameters
In-circuit test fixture with a bed-of-nails

Programming & Configuration

Where required, we can integrate programming and configuration into the manufacturing process.

MCU Programming Firmware Loading Device Configuration Serial Number Writing MAC Address Programming
Firmware programming station with a PCB

Functional Testing

Functional testing evaluates whether the assembled product actually performs according to its intended application.

Depending on the product, testing may include:

Power-On Testing
Communication Testing
Sensor Testing
Display Testing
Input / Output Testing
Functional Verification
Functional test station with a PCB on the bench

Reliability Testing

According to project requirements, additional testing can be incorporated into the manufacturing process.

Burn-In Temperature Testing Voltage Testing Load Testing Environmental Testing
Environmental test chamber with PCB assemblies

Quality Data You Can Trust

Test results can be integrated into the manufacturing quality process to provide greater visibility into:

Pass / Fail Results
Defect Analysis
Yield
Production Trends
Traceability
Quality data monitoring wall with charts

Frequently Asked Questions

How do you test a PCBA?

Depending on the product: AOI after reflow, X-ray (AXI) for hidden joints, ICT or flying probe for electrical checks, and functional testing (FCT) to verify the product works as specified. The methods are complementary — the test plan is defined per product.

What does AOI check, and can it find all problems?

AOI uses cameras and algorithms to check visible features — component position, missing parts, offset, polarity, and solder joints. It has limits on joints hidden under BGA or bottom-terminated devices, which is why some products need X-ray as a supplement.

What is the difference between ICT and FCT?

ICT leans toward structure, electrical connectivity, and component parameters at test points. FCT focuses on whether the product actually works as required — I/O, power, communication, buttons, sensors. The two are complementary.

How do you handle a defective assembly?

Rework restores a nonconforming solder joint, component, or assembly to specification under a controlled process; repair handles more complex issues such as damaged conductors, pads, or laminate structure. Both avoid shipping a nonconforming unit.

Is 100% inspection available?

Yes — every assembly passes AOI after reflow as standard; X-ray coverage, ICT, and FCT are defined per product in the test plan based on package mix and functional risk.

Quality Is More Than Visual Inspection

Our testing capabilities help verify that your PCBA is not only assembled correctly but also performs as required.

Discuss Your Testing Requirements
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