PCBA Glossary: 132 Essential Terms

AOIInspection & Test

Automated Optical Inspection

A camera-based inspection process that compares an assembled board with programmed criteria to detect placement, polarity, solder and visible component defects.

Reference: IPC-9111

AQLQuality & Compliance

Acceptable Quality Limit

A statistical sampling threshold used to decide whether a production lot is accepted or rejected. The agreed sampling plan should state lot size, inspection level and defect class.

Reference: ISO 2859-1

Annular RingPCB Fabrication

Annular Ring

The copper area surrounding a finished drilled hole. Adequate ring width helps maintain electrical and mechanical integrity after drilling and plating tolerances are considered.

Reference: IPC-6012F

Aspect RatioPCB Fabrication

Hole Aspect Ratio

The relationship between board thickness and drilled-hole diameter. Higher ratios are more difficult to plate reliably and must match the fabricator’s process capability.

Reference: IPC-6012F

ArrayProduction & Sourcing

PCB Array / Production Panel

Multiple copies of one or more PCB designs arranged in a larger panel for efficient fabrication and assembly, then separated by routing, tabs or V-scoring.

Reference: IPC-D-326A

Bare BoardPCB Fabrication

Bare Printed Circuit Board

A fabricated PCB before electronic components are assembled. It includes the conductor pattern, holes, dielectric structure and specified surface finish.

Reference: IPC-6012F

Bed of NailsInspection & Test

Bed-of-Nails Fixture

A custom test fixture containing spring probes that contact designated test points, commonly used for fast in-circuit or functional testing in volume production.

Reference: IPC-9111

BGAComponents & Packages

Ball Grid Array

An integrated-circuit package with an underside grid of solder balls. Its hidden joints normally require controlled reflow and X-ray inspection.

Reference: JEDEC Dictionary

Blind ViaPCB Fabrication

Blind Via

A plated connection from an outer layer to one or more inner layers that does not pass through the entire board, often used in HDI designs.

Reference: IPC-6012F

BOMDesign & Data

Bill of Materials

The controlled list of components required to build an assembly, normally including manufacturer part number, quantity, description, reference designators and approved alternatives.

Reference: IPC design standards

Box BuildProduction & Sourcing

System / Box-Build Assembly

Integration of PCBAs with enclosures, displays, cable harnesses, mechanical parts, labels and software into a complete or near-complete product.

Reference: IPC-D-326A

Buried ViaPCB Fabrication

Buried Via

A plated connection between internal PCB layers that is not visible from either outer surface after lamination.

Reference: IPC-6012F

CADDesign & Data

Computer-Aided Design

Software used to create schematics, PCB layouts, mechanical models and the manufacturing data derived from them.

Reference: IPC design standards

CAFPCB Fabrication

Conductive Anodic Filament

An electrochemical failure mechanism in which a conductive path can grow along the glass-resin interface under voltage, moisture and contamination.

Reference: IPC-6012F

CAMDesign & Data

Computer-Aided Manufacturing

The software and data-preparation stage that converts design outputs into tooling and machine instructions for PCB fabrication or assembly.

Reference: IPC design standards

Castellated HolePCB Fabrication

Castellated Plated Hole

A plated through-hole cut along the board edge to create a solderable half-cylinder, commonly used for modules mounted onto a host PCB.

Reference: IPC-6012F

CEMS / EMSProduction & Sourcing

Contract Electronics Manufacturing Services

Outsourced electronics manufacturing covering activities such as component sourcing, PCB assembly, programming, testing and product integration.

Reference: IPC-D-326A

Conformal CoatingQuality & Compliance

Conformal Coating

A thin protective coating applied to an assembled board to help resist moisture, contamination, chemicals and electrical leakage in its intended environment.

Reference: UL Solutions

Controlled ImpedanceDesign & Data

Controlled Impedance

Designing and fabricating a trace to meet a target impedance by controlling geometry, copper thickness, dielectric properties and stack-up.

Reference: IPC design standards

Copper WeightPCB Fabrication

Copper Weight / Thickness

A traditional way to specify copper thickness by the weight spread over one square foot; one ounce is approximately 35 micrometres before process variation.

Reference: IPC-6012F

CpkQuality & Compliance

Process Capability Index

A statistical measure of how well a stable process fits within specification limits while accounting for process centring and variation.

Reference: NIST Engineering Statistics

CSPComponents & Packages

Chip-Scale Package

A very small integrated-circuit package whose footprint is close to the size of the semiconductor die, enabling high density but tighter assembly controls.

Reference: JEDEC Dictionary

CTEPCB Fabrication

Coefficient of Thermal Expansion

The rate at which a material changes dimension with temperature. PCB Z-axis CTE is especially relevant to plated-hole and via reliability during thermal cycles.

Reference: IPC-6012F

Daisy ChainDesign & Data

Daisy-Chain Test Circuit

A continuous series connection routed through package interconnects or test coupons so resistance changes can reveal joint or connection failures.

Reference: IPC design standards

DFADesign & Data

Design for Assembly

Design practices that make a product easier and more consistent to assemble, including component orientation, access, spacing, fastening and process selection.

Reference: IPC design standards

DFMDesign & Data

Design for Manufacturability

Reviewing a design against fabrication and assembly capabilities to reduce defects, cost, schedule risk and avoidable production variation.

Reference: IPC design standards

DFTDesign & Data

Design for Testability

Designing test points, programming access, isolation and diagnostic coverage into the product so production testing is practical and effective.

Reference: IPC design standards

DelaminationPCB Fabrication

Delamination

Separation between laminate layers or interfaces, potentially caused by moisture, contamination, weak bonding or thermal stress.

Reference: IPC-6012F

DNP / DNIDesign & Data

Do Not Populate / Install

A BOM or assembly-drawing instruction that identifies a designed component location that must remain unpopulated for the specified product variant.

Reference: IPC design standards

DRCDesign & Data

Design Rule Check

An automated CAD check for layout violations such as insufficient clearance, trace width, hole spacing or unconnected nets.

Reference: IPC design standards

ECADDesign & Data

Electronic Computer-Aided Design

The class of tools used for circuit capture, component libraries, PCB layout, rule checking and electronics manufacturing output.

Reference: IPC design standards

ENIGPCB Fabrication

Electroless Nickel Immersion Gold

A flat PCB surface finish consisting of electroless nickel covered by a thin immersion-gold layer, widely used for solderability and exposed contacts.

Reference: IPC-6012F

ENEPIGPCB Fabrication

Electroless Nickel Electroless Palladium Immersion Gold

A multilayer surface finish that adds a palladium barrier between nickel and gold, supporting soldering and selected wire-bonding applications.

Reference: IPC-6012F

ESDQuality & Compliance

Electrostatic Discharge

A rapid transfer of electrostatic charge that can immediately damage or weaken sensitive electronic devices; controlled handling uses grounded personnel, tools and work areas.

Reference: EOS/ESD Association

E-TestInspection & Test

Bare-Board Electrical Test

Continuity and isolation testing of a fabricated PCB against a netlist to identify open circuits, shorts and unintended connections before assembly.

Reference: IPC-9111

FAIQuality & Compliance

First Article Inspection

Detailed verification of the first completed unit or initial production sample before the remaining build proceeds, based on an agreed checklist or drawing.

Reference: IPC PCBA Checklist

FCTInspection & Test

Functional Circuit Test

A powered test that verifies defined board or product functions through its inputs, outputs, interfaces, firmware and representative loads.

Reference: IPC-9111

FiducialDesign & Data

Fiducial Mark

A defined copper target used by vision systems to align a PCB or local fine-pitch area during printing, placement and inspection.

Reference: IPC design standards

Flying ProbeInspection & Test

Flying-Probe Test

A fixtureless electrical test using movable probes. It offers flexible coverage and low setup cost, making it useful for prototypes and lower-volume builds.

Reference: IPC-9111

FluxAssembly Process

Soldering Flux

A chemical material that removes or inhibits surface oxides and promotes solder wetting. Its activity, residue and cleaning requirements must suit the process.

Reference: IPC-9111

FootprintDesign & Data

PCB Footprint / Land Pattern

The pattern of pads, holes, courtyard and assembly information assigned to a component package on the PCB layout.

Reference: IPC design standards

FR-4PCB Fabrication

Flame-Retardant Glass-Epoxy Laminate

A widely used family of glass-reinforced epoxy PCB laminates. “FR-4” is a material class, so electrical and thermal properties still need specification.

Reference: IPC-6012F

GerberDesign & Data

Gerber Layer Format

The de facto open vector format for transferring PCB layer images such as copper, solder mask and legend, with attributes carrying manufacturing context.

Reference: Ucamco Gerber Specification

Golden BoardInspection & Test

Golden Board / Reference Unit

An approved, known-good assembly used as a comparison reference for test development, troubleshooting or production verification. Its revision and status must be controlled.

Reference: IPC-9111

HALTInspection & Test

Highly Accelerated Life Test

A development method that applies progressively severe stresses to expose design margins and weaknesses; it is not a direct prediction of service life.

Reference: NASA Accelerated Life Testing

HASSInspection & Test

Highly Accelerated Stress Screening

A production screening method derived from product limits to reveal workmanship or component defects without consuming excessive product life.

Reference: NASA Accelerated Life Testing

HASLPCB Fabrication

Hot Air Solder Leveling

A PCB surface finish formed by coating exposed copper with solder and using hot air to remove excess. Both tin-lead and lead-free variants exist.

Reference: IPC-6012F

HDIPCB Fabrication

High-Density Interconnect

PCB technology using features such as microvias, fine conductors and sequential lamination to achieve higher routing density than conventional construction.

Reference: IPC-6012F

HICQuality & Compliance

Humidity Indicator Card

A card with humidity-sensitive indicators used inside dry packaging to show whether specified relative-humidity levels have been exceeded.

Reference: IPC-1602

ICComponents & Packages

Integrated Circuit

An electronic circuit fabricated on semiconductor material and normally supplied in a package with defined electrical and mechanical connections.

Reference: NIST Semiconductor Glossary

ICTInspection & Test

In-Circuit Test

An electrical test of component values and circuit nodes on an assembled board, often using a bed-of-nails fixture to find opens, shorts and incorrect parts.

Reference: IPC-9111

IMCAssembly Process

Intermetallic Compound

A metallurgical layer formed where solder reacts with the base finish. Some growth is necessary for bonding; excessive or brittle growth can reduce reliability.

Reference: IPC-9111

IPCQuality & Compliance

Global Electronics Standards Association

The industry association that develops widely used standards for electronic design, printed boards, assembly, acceptability, materials, testing and workmanship.

Reference: IPC Standards Tree

IQCQuality & Compliance

Incoming Quality Control

Inspection and verification of incoming components, bare boards and materials before they are released to production.

Reference: IPC PCBA Checklist

Ionic ContaminationQuality & Compliance

Ionic Contamination

Mobile ionic residue left on a board that can contribute to corrosion, leakage or electrochemical migration when moisture and electrical bias are present.

Reference: IPC PCBA Checklist

J-STD-001Quality & Compliance

Requirements for Soldered Assemblies

An IPC standard defining materials, methods, process controls and acceptance requirements for producing soldered electrical and electronic assemblies.

Reference: IPC PCBA Checklist

J-STD-033Quality & Compliance

Handling of Moisture-Sensitive Devices

An IPC/JEDEC standard covering packing, shipping, handling and use of moisture- and reflow-sensitive surface-mount devices.

Reference: IPC PCBA Checklist

KeepoutDesign & Data

Keepout Zone

A defined layout area where specified items—such as copper, vias or components—are prohibited for mechanical, electrical, RF or manufacturing reasons.

Reference: IPC design standards

KittingProduction & Sourcing

Material Kitting

Collecting, verifying and staging the components and materials required for a specific work order before production begins.

Reference: IPC-D-326A

Land PatternDesign & Data

Land Pattern

The geometric arrangement of PCB pads intended to connect and mechanically support a specific component package.

Reference: IPC design standards

LGAComponents & Packages

Land Grid Array

A package with an underside array of flat conductive lands instead of formed leads or solder balls; connection may be soldered or socketed.

Reference: JEDEC Dictionary

Lead-FreeQuality & Compliance

Lead-Free Assembly

An assembly process using solders and finishes that meet the applicable lead restrictions. It typically requires higher process temperatures than tin-lead soldering.

Reference: IPC PCBA Checklist

LegendPCB Fabrication

Legend / Silkscreen

Printed reference designators, symbols, polarity marks and other identification graphics applied to a PCB surface.

Reference: IPC-6012F

Lot TraceabilityProduction & Sourcing

Lot Traceability

The ability to link finished assemblies to controlled records such as work order, material lot, supplier, date code, process route, inspection and test results.

Reference: IPC-D-326A

MCPCBPCB Fabrication

Metal-Core Printed Circuit Board

A PCB built with a metal base—commonly aluminium—to spread heat from power devices or LEDs through a dielectric layer.

Reference: IPC-6012F

MCUComponents & Packages

Microcontroller Unit

An integrated circuit containing a processor, memory and peripherals for embedded control; it usually requires programmed firmware to perform product functions.

Reference: NIST Semiconductor Glossary

MESProduction & Sourcing

Manufacturing Execution System

Software that manages and records shop-floor production activity, including work orders, routing, material use, process status and traceability.

Reference: IPC-D-326A

MicroviaPCB Fabrication

Microvia

A small blind structure, typically laser formed, used for interlayer connection in HDI boards. Its geometry and stacking strategy affect reliability.

Reference: IPC-6012F

MBBQuality & Compliance

Moisture Barrier Bag

A low-water-vapour-transmission bag used with desiccant and a humidity indicator card to dry-pack moisture-sensitive devices or boards.

Reference: IPC-1602

MSLQuality & Compliance

Moisture Sensitivity Level

A classification indicating how long a moisture-sensitive component may remain exposed to specified factory conditions before reflow risk requires baking or other action.

Reference: IPC PCBA Checklist

NetlistDesign & Data

Netlist

A machine-readable description of intended electrical connections, used to transfer design connectivity and verify PCB or assembly test data.

Reference: IPC design standards

No-Clean FluxAssembly Process

No-Clean Flux

A flux formulated so that, under a controlled process, the remaining residue may be left on the assembly. “No-clean” does not mean residue is acceptable in every application.

Reference: IPC-9111

Non-WettingAssembly Process

Non-Wetting

A solder defect in which molten solder fails to form an acceptable bond to a surface, often related to oxidation, contamination, finish condition or process heat.

Reference: IPC-9111

NPIProduction & Sourcing

New Product Introduction

The controlled transition from design into repeatable manufacturing, including data review, prototyping, tooling, programming, pilot build, validation and process release.

Reference: IPC-D-326A

NPTHPCB Fabrication

Non-Plated Through-Hole

A drilled hole without conductive barrel plating, generally used for mechanical mounting, tooling or component alignment.

Reference: IPC-6012F

ODB++Design & Data

Open Database PCB Exchange Format

A structured data-exchange format that can transfer PCB design, fabrication, assembly and test information in one manufacturing-oriented product model.

Reference: Siemens ODB++

ODMProduction & Sourcing

Original Design Manufacturer

A supplier that designs and manufactures a product or platform for another company, with ownership, customization and branding defined by contract.

Reference: IPC-D-326A

OEMProduction & Sourcing

Original Equipment Manufacturer

A company responsible for the marketed product or equipment. In PCBA projects, the term may also describe build-to-print work performed to the customer’s released design.

Reference: IPC-D-326A

OSPPCB Fabrication

Organic Solderability Preservative

A thin organic finish applied to exposed copper to preserve solderability before assembly; handling and thermal-history limits must be controlled.

Reference: IPC-6012F

Open CircuitInspection & Test

Open Circuit

An unintended interruption in an electrical path caused by issues such as a broken trace, unconnected pin, cracked joint or insufficient solder connection.

Reference: IPC-9111

PanelizationProduction & Sourcing

Panelization

Arranging PCBs within a production panel and adding rails, tooling holes, fiducials and separation features to support fabrication and assembly.

Reference: IPC-D-326A

Pin-in-PasteAssembly Process

Pin-in-Paste / Intrusive Reflow

A process that prints solder paste into or around plated holes so selected through-hole components can be soldered during the SMT reflow cycle.

Reference: IPC-9111

PCBPCB Fabrication

Printed Circuit Board

A structure that mechanically supports and electrically connects components through conductive patterns, insulating materials, holes and interconnections.

Reference: NIST PCB Glossary

PCBAAssembly Process

Printed Circuit Board Assembly

A PCB after electronic and mechanical components have been mounted and interconnected by soldering, press-fit or another approved assembly process.

Reference: IPC PCBA Checklist

Pick-and-PlaceAssembly Process

Automated Component Placement

The automated process of collecting components from feeders, identifying them and placing them at programmed coordinates and rotations on solder paste.

Reference: IPC-9111

PoPComponents & Packages

Package on Package

A stacked packaging method in which one component package is mounted above another, often combining a processor and memory while conserving PCB area.

Reference: JEDEC Dictionary

Press-FitAssembly Process

Press-Fit Connection

A solderless interconnection formed by pressing a compliant pin into a controlled plated through-hole, creating mechanical retention and electrical contact.

Reference: IPC-9111

PrepregPCB Fabrication

Pre-Impregnated Bonding Material

Glass reinforcement pre-impregnated with partially cured resin, used to bond and insulate layers during multilayer PCB lamination.

Reference: IPC-6012F

PTHPCB Fabrication

Plated Through-Hole

A hole with a conductive plated barrel connecting layers and, when designed as a component hole, accepting a through-hole lead or pin.

Reference: IPC-6012F

QFNComponents & Packages

Quad Flat No-Lead Package

A low-profile package with bottom or perimeter lands and often an exposed thermal pad; paste volume and void control are important.

Reference: JEDEC Dictionary

QFPComponents & Packages

Quad Flat Package

An integrated-circuit package with gull-wing leads extending from four sides, available in several body sizes and fine lead pitches.

Reference: JEDEC Dictionary

QMSQuality & Compliance

Quality Management System

The documented framework of responsibilities, processes, controls, records and improvement activities used to consistently meet customer and regulatory requirements.

Reference: ISO 9001

ReflowAssembly Process

Reflow Soldering

A controlled heating process that melts deposited solder paste to form joints between surface-mount component terminations and PCB lands.

Reference: IPC-9111

ReworkAssembly Process

Rework

Repeating or correcting an assembly operation to make a nonconforming product meet requirements, such as removing and replacing a component under controlled instructions.

Reference: IPC-9111

RFDesign & Data

Radio Frequency

High-frequency electromagnetic operation where trace geometry, materials, impedance, return paths, shielding and antenna placement strongly affect circuit performance.

Reference: IPC design standards

Rigid-FlexPCB Fabrication

Rigid-Flex PCB

A single interconnect structure combining rigid and flexible regions, reducing connectors while requiring careful bend, material and stack-up design.

Reference: IPC-6012F

RoHSQuality & Compliance

Restriction of Hazardous Substances

European Union rules restricting specified hazardous substances in electrical and electronic equipment. Compliance applies to the product and relevant exemptions, not just the PCB.

Reference: European Commission

RMAProduction & Sourcing

Return Material Authorization

A controlled process and identifier for returning product to a supplier for verification, failure analysis, repair, replacement or credit.

Reference: IPC-D-326A

Selective SolderingAssembly Process

Selective Soldering

An automated process that applies flux and molten solder only to selected through-hole locations, useful for mixed-technology assemblies.

Reference: IPC-9111

Short CircuitInspection & Test

Short Circuit

An unintended low-resistance connection between conductors that should be electrically separate, caused by issues such as solder bridging, debris or PCB defects.

Reference: IPC-9111

SMDComponents & Packages

Surface-Mount Device

An electronic component designed for mounting directly to pads on the PCB surface rather than through conventional lead holes.

Reference: JEDEC Dictionary

SMTAssembly Process

Surface-Mount Technology

The assembly method of applying solder paste, placing surface-mount devices and reflow soldering them to PCB lands.

Reference: IPC-9111

Solder MaskPCB Fabrication

Solder Mask

A patterned polymer coating that protects PCB conductors and limits solder to intended areas. It is not the same as a qualified conformal coating.

Reference: UL Solutions

Solder PasteAssembly Process

Solder Paste

A controlled mixture of solder-alloy powder and flux medium deposited onto PCB lands, normally by stencil printing, before component placement and reflow.

Reference: IPC-9111

SolderabilityQuality & Compliance

Solderability

The ability of a termination or PCB finish to be wetted by molten solder and form an acceptable connection under specified conditions.

Reference: IPC PCBA Checklist

SPIInspection & Test

Solder Paste Inspection

Automated measurement of printed solder-paste deposits, commonly checking volume, area, height, shape and positional offset before component placement.

Reference: IPC-9111

Stack-UpPCB Fabrication

PCB Layer Stack-Up

The ordered construction of copper and dielectric layers, including materials and thicknesses, that determines board thickness, impedance and structural behaviour.

Reference: IPC-6012F

StencilAssembly Process

SMT Solder-Paste Stencil

A patterned metal foil whose apertures control where and how much solder paste is printed onto the PCB.

Reference: IPC-9111

Surface FinishAssembly Process

PCB Surface Finish

The protective, solderable finish applied to exposed PCB copper, such as ENIG, HASL or OSP, selected for assembly, storage and end-use needs.

Reference: IPC-9111

TdPCB Fabrication

Decomposition Temperature

A laminate property indicating the temperature at which a defined level of material decomposition or weight loss occurs; it is distinct from Tg.

Reference: IPC-6012F

Test CouponInspection & Test

PCB Test Coupon

A representative structure placed on a production panel for evaluating characteristics such as impedance, plating, registration or microvia quality.

Reference: IPC-9111

Test PointDesign & Data

Test Point

An accessible conductive feature intentionally provided for probing, programming, measurement or automated production test.

Reference: IPC design standards

TgPCB Fabrication

Glass Transition Temperature

The temperature region where a PCB laminate’s polymer matrix changes from a rigid glass-like state to a softer state with different expansion behaviour.

Reference: IPC-6012F

Thermal ProfileAssembly Process

Reflow Thermal Profiling

Measuring board temperatures over time with thermocouples to verify preheat, soak, time above liquidus, peak temperature and cooling against process limits.

Reference: IPC-9111

Thermal ReliefAssembly Process

Thermal-Relief Connection

A spoke-style connection between a pad and copper plane that reduces heat flow during soldering while maintaining electrical connection.

Reference: IPC-9111

THTAssembly Process

Through-Hole Technology

An assembly method in which component leads or pins pass through PCB holes and are soldered by wave, selective or manual processes.

Reference: IPC-9111

TombstoningAssembly Process

Chip-Component Tombstoning

A reflow defect in which one end of a small two-terminal component lifts from its pad due to unbalanced wetting forces or thermal conditions.

Reference: IPC-9111

TraceDesign & Data

PCB Trace / Conductor

A patterned conductive path on or within a PCB that carries electrical signals or power between connection points.

Reference: IPC design standards

ULQuality & Compliance

UL Solutions / Safety Certification

A safety-science and certification organization. PCB materials, constructions and coatings may carry defined recognition; this does not automatically certify the finished product.

Reference: UL Solutions

UnderfillAssembly Process

Underfill Encapsulant

A resin applied beneath packages such as BGA or CSP devices to redistribute mechanical and thermal stress and improve robustness in selected applications.

Reference: IPC-9111

UUT / DUTInspection & Test

Unit / Device Under Test

The board, module, device or product currently connected to test equipment and evaluated against defined requirements.

Reference: IPC-9111

V-ScorePCB Fabrication

V-Scoring / V-Grooving

Partial V-shaped grooves cut from both sides of a PCB panel to leave a controlled web that can be separated after assembly.

Reference: IPC-6012F

ViaPCB Fabrication

Via

A plated structure used primarily to make an electrical connection between conductor layers rather than to accept a component lead.

Reference: IPC-6012F

Via-in-PadPCB Fabrication

Via-in-Pad

A via located within a component land, often filled and capped to create a flat solderable surface and enable routing from fine-pitch packages.

Reference: IPC-6012F

VoidingInspection & Test

Solder-Joint Voiding

Internal cavities within a solder connection, typically evaluated by X-ray. Acceptance depends on joint type, location, coverage and applicable specification.

Reference: IPC-9111

Wave SolderingAssembly Process

Wave Soldering

A process in which a fluxed, preheated assembly passes over a controlled wave of molten solder to join through-hole and selected bottom-side components.

Reference: IPC-9111

WEEEQuality & Compliance

Waste Electrical and Electronic Equipment

European Union requirements addressing collection, treatment and recycling of electrical and electronic equipment at end of life.

Reference: European Commission

WettingAssembly Process

Solder Wetting

The spreading and bonding of molten solder to a clean, solderable metal surface, producing a characteristic contact angle and continuous interface.

Reference: IPC-9111

WIPProduction & Sourcing

Work in Process

Materials or units that have entered production but have not yet completed all required manufacturing, inspection and test operations.

Reference: IPC-D-326A

X-Ray / AXIInspection & Test

X-Ray Inspection

Non-destructive imaging used to inspect hidden or internal features such as BGA joints, bottom-terminated components, voids, bridging and through-hole fill.

Reference: IPC-9111

Yield / FPYQuality & Compliance

Production Yield / First-Pass Yield

The proportion of units meeting defined requirements. First-pass yield counts units that pass without rework, giving a clearer view of process effectiveness.

Reference: NIST Engineering Statistics

Z-Axis ExpansionPCB Fabrication

Z-Axis Expansion

Thermal expansion through the thickness of a PCB laminate. Excessive expansion during assembly cycles can stress plated-hole barrels and internal connections.

Reference: IPC-6012F